The new DDf Ultra expands upon the capabilities of the original DDf by handling smaller and thinner die and improving die presentation rates, especially for flip chips. Applications with die sizes down to 0.5 mm sq and below, and as thin as 65 μm, can be routinely presented at rates of up to 5,000 units per hour for flip chips, and 3,500 units per hour for bare die. In addition, with our standardized interface, the DDf Ultra can be mounted on virtually any placement machine, from a customized assembly cell to a high speed SMT machine.

Our DDf technology can turn almost any chip shooter into a Flip Chip Shooter, almost any SMT machine into an Advanced Semiconductor Assembly solution, and almost any custom automation platform into a Flexible Semiconductor Assembly solution.

By utilizing DDf technology, customers can
realize significant savings by:

• Eliminating separate production lines for SMT, bare die, and flip chip by combining them into one.
• Enabling total assembly solutions with much higher speed and / or flexibility, resulting in lower cost per placement.
• Eliminating costly, non-value added processes, such as intermediate die transfer into pocketed tape, surf-tape,
  or waffle packs prior to placement.