The DDf technology from Hover-Davis crosses the threshold of a new era in electronics manufacturing. The DDf enables you to introduce wafer-level devices to your placement equipment and eliminate the costs associated with packaging.

Our DDf technology can turn almost any chip shooter into a Flip Chip Shooter, almost any SMT machine into an Advanced Semiconductor Assembly solution, and almost any custom automation platform into a Flexible Semiconductor Assembly solution.

By utilizing DDf technology, customers can
realize significant savings by:

• Eliminating separate production lines for SMT, bare die, and flip chip by combining them into one.
• Enabling total assembly solutions with much higher speed and / or flexibility, resulting in lower cost per placement.
• Eliminating costly, non-value added processes, such as intermediate die transfer into pocketed tape, surf-tape,
  or waffle packs prior to placement.